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End-to-End Solutions: From Component Procurement to PCB Manufacturing and Assembly

One-Stop Component Procurement

Full-range precision component sourcing (instant BOM quoting)
Cost-saving cross-brand alternatives (with sample testing)
Genuine parts direct from manufacturers, backed by strict QC

Supply Chain Optimization & Risk Management

Real-time shortage alerts and alternative solutions
Global supplier network for stable supply

PCB Fabrication & Assembly (PCBA)

High-precision PCB manufacturing (prototype to mass production)
End-to-end PCBA services (SMT/DIP hybrid assembly)
Functional testing & reliability validation

End-to-End Electronics Manufacturing

Integrated solutions from design to delivery
Optimized for cost, precision, and time-to-market

Jieecn Componet QC/Q

Supplier Screening & Qualification

Visual Inspection (VI)

Electrical Parameter Testing

X-ray Inspection (AXI)

Decapsulation Analysis

Supplier Screening & Qualification

Leveraging two decades of industry connections and authoritative component association networks, our rigorous supplier qualification process eliminates 90% of quality risks - including counterfeit, refurbished, and substandard components - at the sourcing stage.

Visual inspection (VI)

·Packaging inspection - Validate anti-tampering features & OEM-specified materials
·Label authentication - Cross-check batch codes with manufacturer databases
·Surface analysis - Detect sanding/repolishing traces via microscopic examination
·Marking forensic - Verify laser engraving depth/legibility against JEDEC J-STD-609
·Lead inspection - Confirm plating composition and coplanarity (per IPC-A-610)

All findings are benchmarked against original component manufacturer (OCM) golden samples and ERAI counterfeit databases to ensure 100% counterfeit elimination.

Electrical parameter testing

Conduct component parameter measurement using calibrated test equipment in full compliance with applicable industry standards

Conduct comprehensive die package inspection including

·Lead frame integrity verification
·Chip cavity dimensional analysis
·Gold wire bonding structure examination
·Internal delamination detection using SAM (Scanning Acoustic Microscopy)

Decapsulation analysis

·Internal die layout verification
·Silicon die dimension measurement
·Manufacturer logo authentication
·Copyright year decoding
·Wafer lot code traceability to establish component authenticity with 100% confidence.